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    CIS

    ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

    AUTOPIA

    Automatic Active Alignment System (for Automotive Camera Application)

    COSMOS

    Automatic 3D Sensing Alignment System

    Eagle AERO

    For High-end IC Applications

    Lens Holder Attach System

    IS600GS

    Automatic Active Alignment Bonding System for Camera Module Assembly

    Lens Holder Attach System

    IS868LA3

    Automatic Lens Holder Attach System

    DI-water Cleaning System

    ISCM868S

    Automatic DI-Water Cleaning System

    ISLinDA

    Automatic Die Bonding System (12” wafer handling)

    Ball Bonder OPTO/LED Wire Bonding Equipment

    Harrier Xtreme

    Dual-Head Extreme High Speed Wire Bonder

    OPTO/LED Wire Bonding Equipment

    iHawk Xpress XL

    Wire Bonder

    Ball Bonder OPTO/LED Wire Bonding Equipment

    iHawk Xtreme

    Wire Bonder

    Strip Form Substrates AOI System

    VIM300 / IS-VIM300

    Automated Optical Inspection

    Other Applications

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